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3U cPCIe Conduction Cooled Single Board Computer

 - Intel® 3100

 

 

Product Description

Our 3U CompactPCI ® Express Conduction Cooled Single Board Controller with the Intel? 3100 chipset can be scaled to your required price / performance / power requirements. Available processors range from the highest performance Dual-Core Intel® Xeon® Processor LV (2.0 GHz) to the lowest power Intel® Celeron® M processor ULV 373 (1.0 GHz). All models support ECC RAM for demanding applications.

This cPCI Express SBC controls four x4 lane cPCI Express slots. Rear I/O of 1x Ethernet, 2x USB 2.0, 1x COM, and 4x SATA ports are standard on the 1 slot wide module. Front I/O of 1x Ethernet, 1x USB, and 1x COM eases development and testing.

A XMC slot with x8 PCI Express Lane supports add on video or other standard cards. A Compact Flash socket is also on board for applications requiring a compact memory solution.

A SATA HDD carrier accessible through our backplane is available for larger disk applications and offers easy to remove media. Cooling is achieved with an integral CPU hood and conduction cooled card assembly. Wedge locks are utilized to fully dissipate the heat to the conduction cooled chassis.


3U cPCIe CC SBC - Intel® 3100 Diagram

 


3U cPCIe CC Base Board with Intel® 3100 Chipset



Intel® Core Duo Module

 

Technical DATA

CPU
Processors supported with 3100 Chipset:
• Dual-Core Intel® Xeon® Processor LV (2.0 GHz), 2MB L2,

667 MHz FSB
• Dual-Core Intel® Xeon® Processor LV (1.66 GHz), 2MB L2,

667 MHz FSB
• Dual-Core Intel® Xeon® Processor ULV (1.66 GHz), 2MB L2,

667 MHz FSB
• Intel® Celeron® Processor (1.66 GHz), 1MB L2,

667 MHz FSB
• Intel® Pentium® M processor 745 (1.8 GHz) 2 MB L2,

400 MHz FSB
• Intel® Pentium® M processor LV 738 (1.4 GHz) 2 MB L2,

400 MHz FSB
• Intel® Celeron® M processor 370 (1.5 GHz) 1 MB L2,

400 MHz FSB
• Intel® Celeron® M processor ULV 373 (1.0 GHz) 512 KB L2,

400 MHz FSB

Support Functions • Board controller
• Real-time clock, buffered by a Gold Cap
• Watchdog timer
• Temperature measurement
• One user LED
• Reset button

Memory
DRAM
• DDR2-400 up to 2 GB ECC soldered in

Boot Flash
• 8MB soldered in

Factory Settings
• 2KB Serial EEPROM

Backplane Interface
• cPCI Express 4 slots x 4 lanes

Rear I/O Interface
• 2x 10/100/1000 Base-T Ethernet
• 2x COM Port, TTL Level
• 4X USB 2.0
• 2x Serial ATA® (AHCI)

Operating Systems
• DOS 6.22
• Linux
• Microsoft Windows XP
• Microsoft Embedded XP*
• Microsoft Windows Vista (once available)
• Microsoft Windows Server 2003
• QNX (on request)
• VxWorks (on request)

Embedded BIOS Features
• AMI Award BIOS®
• PCI 2.3 compliant
• LAN boot
• Serial ATA boot
• USB boot
• PCI Express
• USB 1.1 and USB 2.0 interfaces
• CMOS Header
• ECC support
• Watchdog Timer (WDT)
• APIC and ACPI Control
• Patch Update Mechanism
• FSB Error Handling Control

Compact Flash Socket
• IDE Type Compact Flash

Power Management
• ACPI 2.0 with Battery support

Environmental
• Temperature - Operating & Storage -40 to +85°C
• Humidity- Operating & Storage - 95% rH. non-cond.
• Altitude: -300m to + 3,000m
• Shock: 15g/11ms, Bump: 10g/16ms
• Vibration (sinusoidal): 2g/10..150Hz
• Conformal coated

Power Consumption
• 12 Volt DC ± 5%):
• Dual-Core Intel® Xeon® Processor LV (2.0 GHz) - 42 Watts
• Dual-Core Intel® Xeon® Processor LV (1.66 GHz) - 38 Watts
• Dual-Core Intel® Xeon® Processor ULV (1.66 GHz) - 29 Watts
• Intel® Celeron® Processor (1.66 GHz) - 37 Watts
• Intel® Pentium® M 745 1.8 GHz - 35 Watts
• Intel® Pentium® M 738 1.4 GHz - 24 Watts
• Intel® Celeron® M 370 1.5 GHz - 22 watts
• Intel® Celeron® M 373 1.0 GHz - 20 watts

Size
• 3U cPCIe board occupying 1 slot (4 HP)
• Dimensions: 100mm (H) x160mm (D)

Cooling
• Conduction Cooled

 

Ordering

PCI_100.000

3U cPCIe SBC w/ Intel® 3100 Chipset and Dual-Core Intel® Xeon® Processor LV (2.0 GHz), 2MB L2, 667 MHz FSB (See Technical Data for other available Intel® processors)

Options

PCI_100.000.2GB

2GB RAM Option (1GB is standard)
PCI_100.000.RIO Rear I/O Transition Card

 

Download cPCIe SBC 3100 Datasheet.pdf


 

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